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Metal Sputtering Target
Created with Pixso. Tungsten Carbon Sputtering Target (WC Sputtering Target)
Detail Information
Place of Origin:
china
Certification:
ISO9001、ISO14001、ISO45001、IAFT16949
Purity:
99.9%-99.95%
Name:
Tungsten Carbon Sputtering Target
Forming Process:
Planar Target: Hot Pressing, Rotary Target: Spraying
Product Specifications:
Planar Targets, Rotating Targets, Irregularly Shaped Targets
Application Fields:
Hard Coatings, Semiconductor Manufacturing, Energy Sector
Packaging Details:
Vacuum-sealed packaging, case-packed for storage and transport
Supply Ability:
Stable supply
Highlight:

Tungsten Carbon Sputtering Target

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WC Sputtering Target

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Tungsten Carbon Sputtering Targets

Product Description

Tungsten Carbon Sputtering Target is a type of functional target material composed of high-melting-point, high-hardness tungsten combined with excellent wear-resistant carbon in a certain proportion. It features a very high density and uniformity. It is primarily used in magnetron sputtering, ion plating, and other vacuum coating processes to produce thin films of excellent properties.

Core Advantages of Tungsten Carbon Sputtering Target

 

l High Hardness and Wear Resistance

 

The combination of tungsten and carbon forms a carbide-like structure, resulting in thin films with high hardness and strong wear resistance, suitable for high-load and harsh working conditions.

 

 

l High Melting Point and Heat Resistance

 

Tungsten has a melting point of up to 3410°C, and carbon also has excellent high-temperature resistance, ensuring that the target and coating remain stable in high-temperature environments.

 

 

l Excellent Adhesion and High Compressive Strength

 

The deposited film adheres firmly to the substrate and has excellent chemical stability, extending the service life of the devices.

 

Main Applications of Tungsten Carbon Sputtering Target

 

l  Hard Coatings

 

It is widely used for hard coatings on tools, molds, and cutters, such as WC and W-C films, enhancing tool wear resistance and service life.

 

 

l Semiconductor Manufacturing

 

It can be used as a barrier layer, conductive layer, or functional layer material for producing stable thin films in semiconductor devices and micro-electro-mechanical systems (MEMS).

 

 

l Energy Sector

 

In solar cell manufacturing, Tungsten Carbon Sputtering Targets are used to deposit reflective layers or conductive layers, improving device efficiency. Tungsten Carbon Sputtering Targets are utilized to fabricate high-temperature and radiation-hardened components for nuclear reactors and extreme high-energy environments. Furthermore, their integration into thermo-electric energy conversion devices significantly enhances thermal recovery and overall energy utilization efficiency.